Since its emergence in the 1980s, radiofrequency (RF) technology has made remarkable strides in the field of sensing applications, gaining widespread recognition. Nowadays, wireless RF sensing systems ...

The global integrated circuit (IC) industry is confronting the physical limitations of Moore's Law. Atomic-layer-thick two-dimensional (2D) semiconductors, such as Molybdenum Disulfide (MoS2), are ...

2D transistors based on 2D materials have been demonstrated in academia and research labs for more than a decade, but none of these demonstrations were compatible with high-volume semiconductor ...

RF front ends are advancing through the integration of high-frequency passive networks with increasingly efficient active devices engineered for ultra-wide bandwidths and constrained power envelopes.

While CMOS technology has made great strides in its ability to fabricate radio frequency (RF) circuitry, many RF chip designers have yet to take advantage of this capability. After long relying on ...

A rapid increase in wireless connectivity and more sensors, coupled with a shift away from monolithic SoCs toward heterogeneous integration, is driving up the amount of analog/RF content in systems ...

Joint Work Shows Next Generations of RF and Optical Front-End Modules (FEM) Could Be Built by the Assembly of Different Silicon Technologies at Wafer Level, Allowing the Dense Co-integration of ...

The radio-frequency circuitry in mobile and portable devices remains some of the most resistant to integration. RF devices are very picky about who their neighbors are, and they sometimes find ...

Connected by Broadcom, the Wi-Fi access point platform with FiFEM delivers up to 40% reduction in RF front end module power SAN JOSE, Calif., June 12, 2023 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: ...