The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...
The conventional flip chip ball grid array (FCBGA) package platform has wide industry usage and provides high electrical performance. However, as high performance requirements increased, it encounters ...
Before testing for potential reliability issues that could crop up with your next board design, familiarize yourself with the physical HALT and virtual-simulation processes. Highly Accelerated ...
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